Thundercomm TurboX C8550 SoM Overview

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The TurboX C8550 SoM (System on Module) is designed based on Qualcomm® Snapdragon™ premium-tier 5G SoC. It is designed with a 4 nm process, for superior performance and power efficiency.

This section summarizes the hardware capabilities of the Thundercomm TurboX C8550 SoM, its peripherals, and packaging specifications. [1] [2] [3] [4] [5] [6]


Figure 1: Qualcomm Robotics RB5 SOM


Hardware characteristics of the SoM

Table 1 shows a summary of the hardware characteristics of the SoM

Table 1: Thundercomm TurboX C8550 SoM - Hardware Summary
Feature Thundercomm TurboX C8550 SoM
Plataform SoC: Qualcomm® Snapdragon™ QCS8550
  • CPU Complex: Octacore Qualcomm® Kryo™: 1x GoldPlus @ 3.2 GHz + 4x Gold @ 2.8 GHz + 3x Silver @ 2.0 GHz.
  • GPU Architecture: Qualcomm® Adreno™ 740 with support for Vulkan, OpenGL® ES and OpenCL™ APIs.
  • Image Signal Processor: Qualcomm® Spectra™ Image Signal Processor - Cognitive ISP, Triple 18-bit ISPs.
Memory
  • 12 GB LPDDR5x, memory up to 4200 MHz
Storage
  • 128 GB (UFS 3.1/4.0)
AI Performance
  • HTP INT8 48 TOPs
  • GPU FP16 12 TOPs
Display
  • 2x DSI D-PHY-1.2 4-lane
  • Support dual MIPI DSI ports, with support for split-link for fold use case
  • Maximum resolution: support up to 3480 × 2160@120 Hz, 3360 × 1600@144 Hz
Camera
  • 4 x CSI D-PHY-1.2 4-lane 2.5 Gbps/lane
  • 2 x CSI C-PHY-2.0 3-trio/D-PHY-1.2 4-lane compatible, C-PHY 13.68 Gbps/trio
  • 2 x CSI D-PHY-1.2 2-lane
  • 5 x concurrent, 3 IFE + 2 IFE-lites
  • Low Power AI subsystem for AON camera (CSI4 with PM8010) (TBD)
  • 3 x 36 MP@30fps – Triple cameras
  • 64 MP + 36 MP@30fps –Dual cameras
  • 1 x 108 MP@30fps – Single camera
Encode/Decode
  • UHD video processing unit
  • Video decode up to 4K240/8K60
  • Video encode up to 4K120/8K30
  • Concurrent 4K60 decode and 4K60 encode for wireless display
  • AV1 decode
  • Native decode support for H.265 Main 10, H.265 Main, H.264 High, and VP9 profile 2
  • Native encode support for H.265 Main 10, H.265 Main, H.264 high formats
Audio
  • 2 x WSA SoundWire interfaces to support up to 4x WSA
  • 6 x I2S with 2 x data lanes to support full duplex stereo, or up to 4-channel Tx/Rx
  • application
  • 1 X I2S supports 4x data lanes for up to eight channels Tx/Rx application
  • 4 X DMIC ports to support up to 8 DMICs
USB
  • 1 x USB 3.1 Gen 2 (with DP V1.4)
PCIE
  • 1 X PCIe Gen4 2-lane
  • 1 X PCIe Gen3 2-lane
QUP
  • QUPs
  • SSC
  • QUPs
  • IIC
  • HUBs
SDIO
  • 2 x SSDIODC: SDC2 has dedicated pins
  • SDC4 is configurable via GPIOs
Debug port
  • 1 x Debug UART
Connectivity
  • No Wi-Fi built-in
Voltage operation
  • 3.2V ~ 4.5V
Dimension and weight
  • 39mm x 33mm x 2.75mm (excluding height of the bottom shieldinghttps://www.qualcomm.com/news/onq/2023/04/qualcomm-qcm8550-and-qcs8550-processors-for-compute-intensive-apps case)
  • Weight: 8g
Package Format
  • Interface form factor: LGA-628
Operating Environment
  • Operation Temperature: -35℃ ~ +75℃
  • Operation Humidity: 5%~95%, non-condensing
Certifications
  • ROHS
  • Reach
  • WEEE
  • TSCA
OS Support
  • Android
  • Linux
  • Ubuntu


In Figure 2 the the block diagram of the SoC: Qualcomm® Snapdragon™ QCS8550 is shown. It's parts are:

  • CPU: Qualcomm® KryoTM
  • GPU: Qualcomm® Adreno™ 740
  • NPU Neural Processing Unit
  • VPU Video Processing Unit
  • Wi-Fi 7
  • LPASS: Audio Sub-System
Figure 2: SoC: Qualcomm® Snapdragon™ QCS8550 Block Diagram

Graphics Processing Unit (GPU)

The Qualcomm® Adreno™ 740 GPU has the following characteristics:

  • Supports the following APIs:
    • For graphics: OpenGL® ES, Vulkan
    • For computing: OpenCL™
  • Clock Speed: 680 MHz

Central Processing Unit (CPU Complex)

The (Octacore) Qualcomm® Kryo™ CPU's cores have the following characteristics:

  • Number of Cores: 8
  • Architecture: 64-bit
  • Clock Speed: Up to 3.2 GHz

CPU cores

  • 1x GoldPlus @ 3.2 GHz:
    • Arm® Cortex®-X3 Processor


  • (2+2) Gold @ 2.8 GHz:
    • 2x Arm® Cortex®-A710 Processor + 2x Arm® Cortex®-A715 Processor


  • 3x Silver @ 2.0 GHz:
    • Arm® Cortex®-A510 Processor

Digital Signal Processor (DSP)

  • Compute DSP: V73 AI-optimized tensor processor, six threads scalar DSP
  • Sensor DSP: Qualcomm® Sensing Hub 3.0

Neural Processing Unit (NPU)

NPU: Qualcomm® Hexagon™ Tensor Processor (HTP) with:

  • Hexagon Vector eXtensions (HVX)
  • Hexagon Matrix eXtensions (HMX)

Image Signal Processor (ISP)

Qualcomm Spectra™ Image Signal Processor - Cognitive ISP, Triple 18-bit ISPs

  • Inputs: 5 cameras
  • Image Signal Processor (ISP) Name: Qualcomm® Spectra™
  • Image Signal Processor (ISP) Type: Image Signal Processor (ISP)
  • Image Signal Processor (ISP) Number: Triple ISP
  • Image Signal Processor (ISP) Bit Depth: 18-bit
  • Triple Camera: 36+36+36 MP1
  • Dual Camera (ZSL, 30 fps): 64+36 MP
  • Dual Camera: 64+36 MP1
  • Single Camera (MFNR, ZSL, 30 fps): 108 MP
  • Features: Mega Low light photography
  • Video Capture: 8K @ 30 fps, 4K @ 120 fps
  • Slow Motion Video Capture: 720p @ 960 fps
  • Video Capture Formats: Dolby Vision®
  • Video Capture Features: Engine for Visual Analytics 3.0
  • Single Camera: Up to 200 MP

Secure processing Unit (SPU)

  • Qualcomm® Trusted Execution Environment (TEE) v5.3
  • Qualcomm® Type-1 Hypervisor enables multiple trusted VMs (TVMs)

References

  1. Thundercomm TurboX C8550, Product Brief. Retrieved September 13, 2024, from [1]
  2. Thundercomm TurboX C8550 SOM . Retrieved September 13, 2024, from [2]
  3. Thundercomm TurboX C8550 SOM Data Sheet. Retrieved September 13, 2024, from [3]
  4. Qualcomm® Hexagon™ Tensor Processor Overview for QCS8550/QCM8550. Retrieved September 13, 2024, from [4]
  5. Pocessors QCS8550. Retrieved September 13, 2024, from [5]
  6. Qualcomm® QCS8550/QCM8550 Processors. Retrieved September 13, 2024, from [6]


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