Carrier Boards

From RidgeRun Developer Wiki





Follow Us On Twitter LinkedIn Email Share this page


NXP i.MX95
Table of Contents [Sticky]


Preferred Partner Logo 3



Verdin Development Board Overview

This section provides an overview of the Verdin Development Board. The board is designed as a full-featured evaluation and development platform for Toradex Verdin System on Modules (SoMs), including the Verdin iMX95. It exposes most of the interfaces available on the Verdin module, enabling developers to prototype, evaluate hardware capabilities, and develop embedded Linux applications.

The Verdin Development Board provides a wide range of connectivity options, including high-speed networking, USB interfaces, display outputs, camera interfaces, and expansion connectors. It is intended to simplify development by providing accessible debugging interfaces, flexible I/O options, and compatibility with multiple Verdin SoMs.

Fig 1. Verdin Development Board. Extracted from link

Carrier Board Accessories

The following accessories can be used with the Verdin Development board. More information can be found on the Verdin Development Board Documentation

Toradex DSI to HDMI Adapter

This adapter converts the Verdin module’s MIPI-DSI display interface into HDMI, allowing the system to connect to standard HDMI monitors for development and debugging.

Fig 2. Toradex DSI to HDMI Adapter. Extracted from link

Toradex DSI to LVDS Adapter

The DSI to LVDS adapter enables compatibility with LVDS displays by converting the MIPI-DSI signal from the Verdin module into an LVDS interface commonly used in industrial displays.

Fig 3. Toradex DSI to LVDS Adapter. Extracted from link

Toradex DSI Display Adapter

This adapter allows direct connection of supported Toradex MIPI-DSI displays to the Verdin Development Board, simplifying display integration during development.

Fig 4. Toradex DSI Display Adapter. Extracted from link

Verdin Industrial Heatsink

The industrial heatsink improves thermal dissipation for the Verdin module during high workloads, helping maintain stable operating temperatures in development and industrial environments.

Fig 5. Verdin Industrial Heatsink. Extracted from link

Chang Hong DA-2458-02 RP-SMA Antenna

This external antenna provides wireless connectivity for Verdin modules equipped with WiFi or Bluetooth capabilities, improving signal reception and transmission.

Fig 6. Chang Hong DA-2458-02 RP-SMA Antenna. Extracted from link

Antenna Cable U.FL to RP-SMA

This cable connects the module’s U.FL antenna connector to an external RP-SMA antenna, enabling flexible antenna placement for improved wireless performance.

Fig 7. U.FL to RP-SMA Antenna Cable. Extracted from link

Capacitive Touch Display 10.1" LVDS

This 10.1-inch capacitive touchscreen uses an LVDS interface and is suitable for graphical user interfaces and industrial applications requiring larger displays.

Capacitive Touch Display 10.1" DSI

This display provides a 10.1-inch capacitive touchscreen connected through the MIPI-DSI interface, enabling high-resolution graphical interfaces directly from the Verdin SoM.

Capacitive Touch Display 7" DSI

A compact 7-inch capacitive touchscreen using the MIPI-DSI interface, commonly used for embedded user interfaces and portable development setups.

Board Components

Fig 7. Connectors and Controls. Extracted from link
  • X1 – Verdin module edge connector (DDR4 SO-DIMM)
  • X2 – Verdin edge connector breakout section 1
  • X3 – Verdin edge connector breakout section 1
  • X4 – Verdin edge connector breakout section 1
  • X5 – Verdin edge connector breakout section 2
  • X6 – Verdin edge connector breakout section 2
  • X7 – Verdin edge connector breakout section 2
  • X15 – Verdin edge connector breakout section 3
  • X16 – Verdin edge connector breakout section 3
  • X17 – Verdin edge connector breakout section 3
  • X8 – I²C GPIO Expander I/Os header
  • X10 – I²C GPIO Expander I/Os header
  • X9 – Power out header
  • X11 – Power out header
  • X13 – Analog audio speaker out header (3-pin stereo)
  • X14 – Analog audio AUX out jack (auxiliary out / line out, stereo)
  • X18 – POGO pins
  • X19 – POGO pins
  • X20 – Analog audio headphone out jack (stereo)
  • X21 – Analog audio AUX in jack (auxiliary in / line in, stereo)
  • X22 – Analog audio microphone input jack (stereo)
  • X23 – User button and switch header
  • X24 – User button and switch header
  • X26 – User button and switch header
  • X27 – User button and switch header
  • X25 – Ethernet connector (Ethernet_1)
  • X28 – Analog audio speaker out connector (mono, screwless connector)
  • X29 – Analog audio speaker out header (2-pin mono)
  • X33 – Mini PCIe connector
  • X34 – USB DRP connector (USB-C, USB 2.0 only)
  • X35 – Ethernet connector (Ethernet_2)
  • X36 – Nano SIM card holder
  • X37 – HDMI connector
  • X38 – User LEDs header
  • X39 – Level shifter header (3.3V)
  • X40 – Level shifter header (1.8V)
  • X47 – MIPI-CSI camera connector
  • X48 – MIPI-DSI display adapter connector
  • X49 – ADC input header
  • X50 – RS485 connector (9-pin D-Sub)
  • X51 – RS232 connector (9-pin D-Sub)
  • X52 – Module-specific mezzanine board connector
  • X53 – Dual USB 3.x host connectors (upper: USBH3, lower: USBH2)
  • X54 – Power control header
  • X55 – SD card connector (4-bit)
  • X56 – JTAG connector
  • X57 – Terminal block power supply connector (7–24 V ±10%)
  • X58 – Barrel jack power supply connector (7–24 V ±10%)
  • X59 – CAN1 interface header (isolated)
  • X60 – CAN2 interface header (isolated)
  • X62 – POGO pin header
  • X63 – POGO pin header
  • X66 – USB-C connector for USB-to-Serial and USB-to-JTAG interfaces (USB 2.0 only)
  • X67 – USB debugger to JTAG interface jumper array



Retrieved from "https://developer.ridgerun.com/wiki/index.php?title=NXP_i.MX95_Technical_Guide/Verdin_Development_Board&oldid=77104"