Known Gaps
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Known Gaps
When extending kernel support to a platform, multiple hardware components must be validated, and some known issues may arise during testing. To help users identify the current state of the platform, this page is divided into two sections: Hardware Components Not Yet Validated and Known Issues.
Hardware Components Not Yet Validated
To help users understand the current validation status of the Xavier platform, the following tables list the hardware components that have not yet been validated and are still awaiting testing.
| Area | Description |
|---|---|
| Stability foundations | Thermal zones, DevFreq, EMC scaling, and watchdog support. |
| Storage and I/O | Such as SD, NVMe, USB 3.0, Wi-Fi, and Bluetooth. |
| Power Management | Verification of suspend/resume functionality, idle states, and thermal behavior under sustained workloads. |
| Area | Description |
|---|---|
| Audio | Validation of audio playback and capture functionality through the supported audio interfaces and codecs. |
| Area | Description |
|---|---|
| DLA (Deep Learning Accelerator) | Validation of DLA functionality for AI inference workloads and framework integration. |
| PVA (Programmable Vision Accelerator) | Validation of PVA support for computer vision and image-processing workloads. |
| RCE (Real-Time Camera Engine) | Validation of the camera processing firmware and real-time camera pipeline functionality. |
| RTCPU (Real-Time CPU) | Validation of the real-time coprocessor firmware and communication mechanisms used by subsystems such as camera, sensors, and other time-critical platform services. |
| Area | Description |
|---|---|
| Secure Boot Chain | Validation of the secure boot process, ensuring that each stage of the boot chain verifies the authenticity and integrity of the next stage before execution. |
| Disk Encryption | Validation of storage encryption mechanisms to protect data at rest and ensure secure access to encrypted partitions. |
| OTA (Over-the-Air Updates) | Validation of remote software update mechanisms, including update deployment, installation, and rollback procedures. |
| OP-TEE | Validation of the Trusted Execution Environment (TEE) provided by OP-TEE, including secure services and communication between the normal and secure worlds. |
| Bootloader Capsule Update | Validation of firmware and bootloader update mechanisms using capsule-based updates to ensure secure and reliable firmware deployment. |
Known Issues
When bringing up support for a new kernel version on a platform, unexpected issues may arise. This section describes known issues with the hardware components tested.
Tegrastats sampling limitations
The information displayed by tegrastats is not always sampled consistently. The sampling interval can be configured using the --interval argument, which specifies how often performance metrics are printed to the terminal. However, the reported values may not accurately reflect the configured sampling period and this seems to be related to some missing paths when the utility is started, as illustrated in the following log:
sudo tegrastats --readall --verbose --interval 1000 [sudo] password for nvidia: WARNING: failed to open /sys/kernel/debug/gpu_pci/clocks/gpcclk WARNING: failed to open /sys/bus/pci/drivers/nvgpu/module/load WARNING: failed to open /sys/kernel/debug/nvmap/iram/size WARNING: failed to open /sys/kernel/debug/tegra_denver/nvmstats/instantaneous_stats ERROR: failed to read /sys/devices/virtual/thermal/thermal_zone4/temp WARNING: failed to open /sys/bus/i2c/devices/0-0040/name WARNING: failed to open /sys/bus/i2c/devices/0-0041/name WARNING: failed to open /sys/bus/i2c/devices/6-0040/name WARNING: failed to open /sys/bus/i2c/devices/7-0040/name 06-03-2026 15:07:30 RAM 2573/15080MB (lfb 2690x4MB) SWAP 0/7540MB (cached 0MB) CPU [21%@2265,13%@2266,11%@2265,10%@2260,15%@2266,14%@2265,21%@2265,18%@2265] EMC_FREQ 5%@2133 GR3D_FREQ 0%@[1377] NVENC 1075 NVENC1 1075 VIC_FREQ 73%@166 APE 150 AUX@50.5C CPU@53C thermal@51.25C Tboard@50C AO@50C GPU@51C Tdiode@53.5C GPU 1078mW/1078mW CPU 2312mW/2312mW SOC 6624mW/6624mW CV 0mW/0mW VDDRQ 462mW/462mW SYS5V 2338mW/2338mW 06-03-2026 15:07:35 RAM 2575/15080MB (lfb 2690x4MB) SWAP 0/7540MB (cached 0MB) CPU [20%@2265,16%@2265,19%@2264,16%@2265,14%@2263,13%@2264,12%@2265,12%@2265] EMC_FREQ 5%@2133 GR3D_FREQ 0%@[1377] NVENC 1075 NVENC1 1075 VIC_FREQ 73%@166 APE 150 AUX@50.5C CPU@53C thermal@51.55C Tboard@50C AO@50C GPU@51C Tdiode@53.5C GPU 1078mW/1078mW CPU 2158mW/2235mW SOC 6626mW/6625mW CV 0mW/0mW VDDRQ 462mW/462mW SYS5V 3225mW/2781mW 06-03-2026 15:07:41 RAM 2576/15080MB (lfb 2689x4MB) SWAP 0/7540MB (cached 0MB) CPU [22%@2265,14%@2265,13%@2266,12%@2264,12%@2265,21%@2265,11%@2265,9%@2265] EMC_FREQ 5%@2133 GR3D_FREQ 0%@[1377] NVENC 1075 NVENC1 1075 VIC_FREQ 71%@166 APE 150 AUX@50.5C CPU@53C thermal@51.55C Tboard@50C AO@50C GPU@51C Tdiode@53.5C GPU 1078mW/1078mW CPU 2312mW/2260mW SOC 6626mW/6625mW CV -154mW/-51mW VDDRQ 462mW/462mW SYS5V 2338mW/2633mW 06-03-2026 15:07:46 RAM 2532/15080MB (lfb 2691x4MB) SWAP 0/7540MB (cached 0MB) CPU [1%@2266,1%@2259,0%@2265,0%@2265,0%@2266,1%@2265,0%@2265,0%@2265] EMC_FREQ 3%@2133 GR3D_FREQ 0%@[1377] VIC_FREQ 115 APE 150 AUX@49.5C CPU@51C thermal@50.4C Tboard@50C AO@49.5C GPU@50.5C Tdiode@53C GPU 1081mW/1078mW CPU 926mW/1927mW SOC 4015mW/5972mW CV 0mW/-38mW VDDRQ 154mW/385mW SYS5V 2180mW/2520mW 06-03-2026 15:07:51 RAM 2532/15080MB (lfb 2691x4MB) SWAP 0/7540MB (cached 0MB) CPU [0%@2265,0%@2266,0%@2261,0%@2263,0%@2257,0%@2266,0%@2265,0%@2269] EMC_FREQ 0%@2133 GR3D_FREQ 0%@[1377] VIC_FREQ 115 APE 150 AUX@48.5C CPU@50.5C thermal@49.55C Tboard@50C AO@49C GPU@50C Tdiode@52.5C GPU 1081mW/1079mW CPU 927mW/1727mW SOC 2472mW/5272mW CV 0mW/-30mW VDDRQ 154mW/338mW SYS5V 2140mW/2444mW