NVIDIA Jetson Orin - Introduction - Carrier Boards - Auvidea X230D

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Auvidea's X230D is meant to address the need to easily migrate from developments based on the AGX Xavier (X221) to the new AGX Orin by fully supporting integration with NVIDIA's SDK.

The X230D delivers industry standard CSI-2 connectors to interface with:

  • RPi-camera modules
  • ArduCam, Vision Components, Framos, Basler, Allied Vision image sensors
  • FPD-Link III


Figure 1: Top view of Forge Carrier for NVIDIA® Jetson AGX Orin™


Table 1: Connect Tech's Forge Carrier Board Specification
Feature Description
Networking
  • 2x 10GBASE-T (10G Ethernet)
  • 2x 1000BASE-T (1G Ethernet)
Camera Inputs 1x DisplayPort
Display
  • 1x 16-Lane MIPI Expansion Connector
  • Interface directly to a range of MIPI CSI, GMSL2 or FPD-Link III image sensors.
USB 1x USB 3.2 Ports (Type-C – OTG Capable), 1x USB 3.2 Ports (Type-C)
Storage 1 x Micro SD/UFS Card Slot, 2x NVMe M.2 Key M Slot
UART
  • 2x @ 3.3V levels UART1 and UART2
  • 2x RS-232/485 UARTs
I2C/SPI
  • 2x I2C Channel @ 3.3V IO
  • 2x SPI Channel @ 3.3V IO
GPIO 4x GPI, 4x GPO
User Expansion
  • 1x M.2 Key E 2230 Wifi/BT (PCIe/USB2)
  • 1x M.2 Key B 3042/3052 (LTE/5G – USB3) with
  • Micro SIM
Input Power +10 to 36V DC Wide Input Power

(6-pin Mini-fit Jr. Connector)

Buttons Power, Reset, Recovery

(Tactile Buttons as well as fine pitch pin header connector)

RTC Battery 3-pin Picoblade connector to accept CTI battery cable assembly
PCB/Electronics Mechanical Information Dimensions: 155mm x 125mm
Operating Temperature -40°C to +85°C (-40°F to +185°F)


You can get this board from the Forge Product Page



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